Tag: Latest electronics components news
Imec to demonstrate 2 metal layer back-end-of-line for the 3nm technology node
imec will use its technology forum ITF USA 2019 to present a dual-damascene 21nm pitch test vehicle relevant for manufacturing the 3nm logic technolo [...]
A UK first – Nissan and Scottish ice-cream vendor Mackie’s have created a zero-emission ice cream van
Based on Nissan’s e-NV200 electric van, it comes with a soft-serve machine, freezer drawer and drinks fridge.
Ice cream is served from a side- [...]
Baidu and Intel collaborate for Intel Nervana Neural Network Processor for Training
The new custom accelerator named Intel® Nervana™ Neural Network Processor for Training (NNP-T) is a new class of efficient deep learning system hardw [...]
Maxim security devices for medical disposables now at Mouser
The devices are also suitable for IoT node authentication and secure management of limited-use consumables.
Offering both contact and contactless [...]
Dimmable LED driver for smart buildings’ lighting
The drivers are supplied connector-ready for a motion sensor which will activate the lighting when required. The drivers can be used for interior or [...]
First-of-its-kind framework for safe automated driving systems
Emphasising safety by design, 11 industry leaders across the automotive and automated driving technology spectrum have published “Safety First for Au [...]
Lattice sensAI Receives Its Fourth Award in 2019 at Electronics Industry Awards
Lattice Semiconductor announced that its sensAI solutions stack has been named the winner of the Internet of Things Product of the Year at the&n [...]
Making PCs more user friendly, greener, and more secure
STMicroelectronics has developed a user presence detection solution where the output from ST’s FlightSense Time-of-Flight (ToF) ranging sensor, is us [...]
HUBER+SUHNER has launched its high-performing 50 GHz SUCOFLEX 550S microwave cable assembly – a customisable solution for longer life-time.
The SUCOFLEX 550S is available in tailored lengths with immediate availability for stock assemblies and a quick manufacturing turnaround on customise [...]
India ready to board the 5G Bus at 5G India 2019
The first day of the 3rd edition of the 5G India 2019 International Conference & Exhibition kicked off in Mumbai on 26th June 2019. 5G [...]
Arm’s top CPU architect Mike Filippo has left the company after ten years to join Apple
At Arm he was responsible the development of the Cortex-A76, A72, and A57, and Arm’s Hercules-AE automotive CPU.
Before joining Arm, F [...]