Tag: Latest electronics components news
Overlay Assisted Inspection Tool for identifying Defects on Assembled PCBs
The fastest and most accurate technique for the human eye and mind to detect defects is through visual comparison of graphic images. Defects that oth [...]
Saudi IoT will Redefine, Rejuvenate, Recreate, Reconnoitre & Resonate the New Wave of Technology in KSA
Saudi Arabia is amidst an imminent Transformation, where Saudi IoT compliments this phase complying to the Kingdom’s Vision. The entire focus is on D [...]
Nordic Semiconductor to unveil wireless solutions for complex IoT applications at CES 2020
Nordic’s nRF9160 SiP for low power cellular IoT, the world’s first dual Arm Cortex-M33 SoC, Bluetooth 5.1 Direction Finding and Thread solutions powe [...]
ON Semiconductor to Demonstrate IoT & Advanced Audio Processing Technologies at CES 2020
Ultra-low-power audio processor enables applications to respond to voice commands
ON Semiconductor will showcase a wide range of innovative techno [...]
Disruptive New Wafer Process Technology, Which Has Potential to Replace CMOS
A collaboration between Nottingham-based start-up, SearchForThe Next (SFN) and Glenrothes-based Semefab introduced a new tra [...]
Tracking Trends & enabling Indian Industry Association to expand their product & business range
Co-organized by Ikonic Exhibition & Conferences Pvt. Ltd. from India, alongside Chaoyu Exposition from China who is also the organisers of IEAE S [...]
Impact of Artificial Intelligence on Indian Market
NITI Aayog’s roadmap for the national Artificial Intelligence (AI) program has given wings to the technology revolution in India. AI offers opportuni [...]
New ownership opens up opportunities for Nexperia
Nexperia, the expert in discrete and MOSFET components and analog & logic ICs, today announced that Wingtech Technology [...]
Silicon Labs, Z-Wave Alliance opens Z-Wave to Silicon & Stack Suppliers
Silicon Labs and the Z-Wave Alliance announce plans to open the Z-Wave Specification as a ratified, multi-source wireless standar [...]
3-D LiDAR Multi-Layer Scanner for reliable object detection
At the 2019 SPS trade fair in Nuremberg, Pepperl+Fuchs presented the new R2300 multi-layer scanner. The sensor for 3-D object detection impresses by [...]
World’s First Smart Orchestrator For Interference-Free Li-fi Networks
LiFi, or visible-light communication, has significant advantages over WiFi, such as data-transmission speed and the data security it offers because l [...]